Hoshine Silicon Industry Co., Ltd. (SHA:603260)
48.76
+0.73 (1.52%)
At close: Mar 6, 2026
Hoshine Silicon Industry Dividend Information
Hoshine Silicon Industry has an annual dividend of 0.45 CNY per share, with a yield of 0.94%. The dividend is paid once per year and the last ex-dividend date was Aug 19, 2025.
Dividend Yield
0.94%
Annual Dividend
0.45 CNY
Ex-Dividend Date
Aug 19, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
-33.82%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-08-19 | 0.450 CNY | 2025-08-19 |
| 2024-08-19 | 0.680 CNY | 2024-08-19 |
| 2023-05-25 | 0.880 CNY | 2023-05-25 |
| 2022-06-07 | 1.510 CNY | 2022-06-07 |
| 2021-05-26 | 0.290 CNY | 2021-05-26 |
* Dividend amounts are adjusted for stock splits when applicable.