Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
23.17
+0.22 (0.96%)
At close: Mar 6, 2026
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.20 CNY per share, with a yield of 0.86%. The dividend is paid once per year and the last ex-dividend date was Jun 11, 2025.
Dividend Yield
0.86%
Annual Dividend
0.20 CNY
Ex-Dividend Date
Jun 11, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
833.27%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-06-11 | 0.200 CNY | 2025-06-11 |
| 2024-07-12 | 0.02143 CNY | 2024-07-12 |
| 2023-09-19 | 0.01786 CNY | 2023-09-19 |
| 2023-06-28 | 0.01071 CNY | 2023-06-28 |
| 2020-07-01 | 0.05714 CNY | 2020-07-01 |
* Dividend amounts are adjusted for stock splits when applicable.