Taiwan IC Packaging Corporation (TPEX:3372)

Taiwan · Delayed Price · Currency is TWD

25.65

+1.85 (7.77%)

At close: Feb 26, 2026

55.45% (1Y)

Market Cap	4.50B
Revenue (ttm)	1.02B
Net Income (ttm)	-243.78M
Shares Out	175.32M
EPS (ttm)	-1.39
PE Ratio	n/a
Forward PE	n/a
Dividend	n/a
Ex-Dividend Date	n/a

Volume	12,078,190
Average Volume	2,410,852
Open	25.00
Previous Close	23.80
Day's Range	24.60 - 26.00
52-Week Range	10.10 - 26.20
Beta	0.48
RSI	68.76
Earnings Date	Mar 5, 2026

About Taiwan IC Packaging

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan. [Read more]

Industry Semiconductors

Sector Technology

Founded 1998

Employees 435

Stock Exchange Taipei Exchange

Ticker Symbol 3372

Full Company Profile

Financial Performance

In 2024, Taiwan IC Packaging's revenue was 904.16 million, an increase of 4.93% compared to the previous year's 861.69 million. Losses were -185.38 million, 4.74% more than in 2023.

Financial Statements

News

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