Taiwan Semiconductor Manufacturing Company Limited (VIE:TSFA)
Austria flag Austria · Delayed Price · Currency is EUR
254.50
+3.00 (1.19%)
At close: Dec 5, 2025

VIE:TSFA Dividend Information

VIE:TSFA has an annual dividend of €2.04 per share, with a yield of 0.80%. The dividend is paid every three months and the last ex-dividend date was Sep 16, 2025.

Dividend Yield
0.80%
Annual Dividend
€2.04
Ex-Dividend Date
Sep 16, 2025
Payout Frequency
Quarterly
Payout Ratio
28.05%
Dividend Growth
26.99%

Dividend History

Ex-Div Date AmountRecord DatePay Date
2025-09-16€0.552082025-09-162025-10-09
2025-06-12€0.53682025-06-122025-07-10
2025-03-18€0.49032025-03-182025-04-10
2024-12-12€0.458162024-12-122025-01-09
2024-09-12€0.44832024-09-122024-10-09
2024-06-13€0.406392024-06-132024-07-11
2024-03-18€0.395852024-03-192024-04-11
2023-12-14€0.353822023-12-152024-01-11
2023-09-14€0.341982023-09-152023-10-12
2023-06-15€0.331542023-06-162023-07-13
2023-03-16€0.338172023-03-172023-04-13
2022-12-15€0.331632022-12-162023-01-12
2022-09-15€0.343572022-09-162022-10-13
2022-06-16€0.374652022-06-172022-07-14
2022-03-16€0.343162022-03-172022-04-14
2021-12-16€0.348562021-12-172022-01-13
2021-09-16€0.32842021-09-172021-10-14
2021-06-17€0.291042021-06-182021-07-15
2021-03-17€0.292232021-03-182021-04-15
2020-12-17€0.289582020-12-182021-01-14
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts