Kostecsys. Company Description

Kostecsys. Co., Ltd. provides low thermal expansion and high thermal conductivity materials for SiC and GaN Next-generation power semiconductors.

Its products include heat spreader materials, ceramic, and liquid crystal packages, RF power device ceramic packages, RF power device polymer packages, QFN packages, lids, laser module packages, and micro cooling systems.

The company also offers high heat dissipation materials, copper pin, copper pillar, thermal matched lead frame, air cavity packages, baseplate, copper baseplate, (pin fin / flat type), photonic integrated circuit packages, liquid cold plate, cooling block, LD packages for laser modules, and current sensor shunt resistors.

Its products are used in electric vehicles, 5G communication, military radar, robots, aerospace, medical, home appliances, and military applications.

Kostecsys. Co., Ltd. was founded in 1997 and is based in Incheon, South Korea.