China Wafer Level CSP Co., Ltd. (SHA:603005)
China
· Delayed Price · Currency is CNY 31.07
-0.57 (-1.80%)
At close: Mar 9, 2026
China Wafer Level CSP Dividend Information
China Wafer Level CSP has an annual dividend of 0.12 CNY per share, with a yield of 0.38%. The dividend is paid once per year and the last ex-dividend date was Jul 4, 2025.
Dividend Yield
0.38%
Annual Dividend
0.12 CNY
Ex-Dividend Date
Jul 4, 2025
Payout Frequency
Annual
Payout Ratio
16.52%
Dividend Growth(1Y)
82.61%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-07-04 | 0.084 CNY | 2025-07-04 |
| 2024-05-24 | 0.046 CNY | 2024-05-24 |
| 2023-07-10 | 0.070 CNY | 2023-07-10 |
| 2022-05-20 | 0.283 CNY | 2022-05-20 |
| 2021-06-15 | 0.14688 CNY | 2021-06-15 |
* Dividend amounts are adjusted for stock splits when applicable.