Tangshan Sunfar Silicon Industries Co.,Ltd. (SHA:603938)
29.20
-0.26 (-0.88%)
Apr 29, 2026, 3:00 PM CST
SHA:603938 Dividend Information
SHA:603938 has an annual dividend of 0.022 CNY per share, with a yield of 0.07%. The dividend is paid once per year and the last ex-dividend date was Jun 13, 2025.
Dividend Yield
0.07%
Annual Dividend
0.022 CNY
Ex-Dividend Date
Jun 13, 2025
Payout Frequency
Annual
Payout Ratio
7.03%
Dividend Growth(1Y)
-67.31%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-06-13 | 0.017 CNY | 2025-06-13 |
| 2024-05-28 | 0.052 CNY | 2024-05-28 |
| 2023-05-11 | 0.275 CNY | 2023-05-11 |
| 2022-05-12 | 0.12286 CNY | 2022-05-12 |
| 2021-04-23 | 0.04082 CNY | 2021-04-23 |
* Dividend amounts are adjusted for stock splits when applicable.