Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
China
· Delayed Price · Currency is CNY 33.82
+0.11 (0.33%)
At close: Apr 29, 2026
SHA:688591 Dividend Information
SHA:688591 has an annual dividend of 0.27 CNY per share, with a yield of 0.79%. The dividend is paid once per year and the last ex-dividend date was Jun 27, 2025.
Dividend Yield
0.79%
Annual Dividend
0.27 CNY
Ex-Dividend Date
Jun 27, 2025
Payout Frequency
Annual
Payout Ratio
48.55%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-06-27 | 0.205 CNY | 2025-06-27 |
| 2024-07-24 | 0.07323 CNY | 2024-07-24 |
* Dividend amounts are adjusted for stock splits when applicable.