Supcon Technology Co.,Ltd (SHA:688777)
China
· Delayed Price · Currency is CNY 74.25
-1.33 (-1.76%)
At close: Mar 6, 2026
Supcon Technology Co.,Ltd Dividend Information
Supcon Technology Co.,Ltd has an annual dividend of 0.71 CNY per share, with a yield of 0.96%. The dividend is paid once per year and the last ex-dividend date was May 30, 2025.
Dividend Yield
0.96%
Annual Dividend
0.71 CNY
Ex-Dividend Date
May 30, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
1.43%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-05-30 | 0.710 CNY | 2025-05-30 |
| 2024-05-30 | 0.700 CNY | 2024-05-30 |
| 2023-06-26 | 0.750 CNY | 2023-06-26 |
| 2022-06-14 | 0.24828 CNY | 2022-06-14 |
| 2021-06-18 | 0.1783 CNY | 2021-06-18 |
* Dividend amounts are adjusted for stock splits when applicable.