Supcon Technology Co.,Ltd (SHA:688777)
China
· Delayed Price · Currency is CNY 77.46
+1.11 (1.45%)
Apr 29, 2026, 3:00 PM CST
Supcon Technology Co.,Ltd Dividend Information
Supcon Technology Co.,Ltd has an annual dividend of 0.28 CNY per share, with a yield of 0.37%. The dividend is paid once per year and the last ex-dividend date was May 30, 2025.
Dividend Yield
0.37%
Annual Dividend
0.28 CNY
Ex-Dividend Date
May 30, 2025
Payout Frequency
Annual
Payout Ratio
145.97%
Dividend Growth(1Y)
1.43%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-05-30 | 0.710 CNY | 2025-05-30 |
| 2024-05-30 | 0.700 CNY | 2024-05-30 |
| 2023-06-26 | 0.750 CNY | 2023-06-26 |
| 2022-06-14 | 0.24828 CNY | 2022-06-14 |
| 2021-06-18 | 0.1783 CNY | 2021-06-18 |
* Dividend amounts are adjusted for stock splits when applicable.