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HP Inc. (SNSE:HPQ)
Chile flag Chile · Delayed Price · Currency is CLP · Price in USD
29.64
0.00 (0.00%)
At close: Apr 27, 2026

HP Inc. Dividend Information

HP Inc. has an annual dividend of 1,093.51 CLP per share, with a yield of 3,689.31%. The dividend is paid every three months and the last ex-dividend date was Mar 11, 2026.

Dividend Yield
3,689.31%
Annual Dividend
1,093.51 CLP
Ex-Dividend Date
Mar 11, 2026
Payout Frequency
Quarterly
Payout Ratio
43.52%
Dividend Growth
2.53%

Dividend History

Ex-Div Date AmountRecord DatePay Date
2026-03-11269.805 CLP2026-03-112026-04-01
2025-12-11274.320 CLP2025-12-112026-01-02
2025-09-10278.54171 CLP2025-09-102025-10-01
2025-06-11270.84367 CLP2025-06-112025-07-02
2025-03-12271.70898 CLP2025-03-122025-04-02
2024-12-11282.38784 CLP2024-12-112025-01-02
2024-09-11259.99002 CLP2024-09-112024-10-02
2024-06-12252.41377 CLP2024-06-122024-07-03
2024-03-12264.95633 CLP2024-03-132024-04-03
2023-12-12241.11968 CLP2023-12-132024-01-03
2023-09-12235.23413 CLP2023-09-132023-10-04
2023-06-13210.96863 CLP2023-06-142023-07-05
2023-03-07210.546 CLP2023-03-082023-04-05
2022-12-13225.04388 CLP2022-12-142023-01-04
2022-09-13229.385 CLP2022-09-142022-10-05
2022-06-07207.1575 CLP2022-06-082022-07-06
2022-03-08203.235 CLP2022-03-092022-04-06
2021-12-07209.6125 CLP2021-12-082022-01-05
2021-09-07150.99539 CLP2021-09-082021-10-06
2021-06-08139.29956 CLP2021-06-092021-07-07
* Amounts are shown in the stock exchange currency (CLP) for convenience.

Dividend Charts