Chipbond Technology Corporation (TPEX:6147)

Taiwan flag Taiwan · Delayed Price · Currency is TWD
144.00
+13.00 (9.92%)
Apr 28, 2026, 1:30 PM CST
140.40%
Market Cap 107.22B
Revenue (ttm) 21.45B
Net Income (ttm) 2.78B
Shares Out 744.59M
EPS (ttm) 3.68
PE Ratio 39.17
Forward PE 31.39
Dividend 2.80 (2.14%)
Ex-Dividend Date Jun 17, 2025
Volume 16,988,913
Average Volume 35,974,475
Open 134.00
Previous Close 131.00
Day's Range 134.00 - 144.00
52-Week Range 50.20 - 151.50
Beta 0.10
RSI 70.20
Earnings Date Apr 30, 2026

About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chi... [Read more]

Sector Technology
Founded 1997
Employees 3,757
Stock Exchange Taipei Exchange
Ticker Symbol 6147
Full Company Profile

Financial Performance

In 2025, Chipbond Technology's revenue was 21.45 billion, an increase of 5.49% compared to the previous year's 20.34 billion. Earnings were 2.78 billion, a decrease of -32.88%.

Financial Statements

News

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