Chipbond Technology Corporation (TPEX:6147)
Taiwan
· Delayed Price · Currency is TWD 52.70
+0.20 (0.38%)
Mar 6, 2026, 1:30 PM CST
Chipbond Technology Dividend Information
Chipbond Technology has an annual dividend of 3.75 TWD per share, with a yield of 7.14%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2025.
Dividend Yield
7.14%
Annual Dividend
3.75 TWD
Ex-Dividend Date
Jun 17, 2025
Payout Frequency
Annual
Payout Ratio
100.62%
Dividend Growth(1Y)
0.01%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-06-17 | 3.75021 TWD | 2025-07-15 |
| 2024-05-23 | 3.750 TWD | 2024-06-14 |
| 2023-06-16 | 5.500 TWD | 2023-07-14 |
| 2022-07-20 | 6.000 TWD | 2022-08-12 |
| 2021-07-21 | 3.800 TWD | 2021-08-13 |
| 2020-07-23 | 4.200 TWD | 2020-08-14 |
* Dividend amounts are adjusted for stock splits when applicable.