HPC SYSTEMS Inc. (TYO:6597)
Japan
· Delayed Price · Currency is JPY 1,775.00
-88.00 (-4.72%)
At close: Mar 9, 2026
HPC SYSTEMS Dividend Information
HPC SYSTEMS has an annual dividend of 32.00 JPY per share, with a yield of 1.72%. The dividend is paid once per year and the next ex-dividend date is Jun 29, 2026.
Dividend Yield
1.72%
Annual Dividend
32.00 JPY
Ex-Dividend Date
Jun 29, 2026
Payout Frequency
Annual
Payout Ratio
22.26%
Dividend Growth(1Y)
14.29%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2026-06-29 | 32.000 JPY | 2026-09-30 |
| 2025-06-27 | 28.000 JPY | 2025-09-30 |
| 2024-06-27 | 25.000 JPY | 2024-09-30 |
| 2023-06-29 | 25.000 JPY | 2023-09-29 |
| 2022-06-29 | 25.000 JPY | 2022-09-30 |
* Dividend amounts are adjusted for stock splits when applicable.