LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
15.48
+0.28 (1.84%)
Mar 10, 2026, 10:33 AM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.67 HKD per share, with a yield of 4.32%. The dividend is paid once per year and the last ex-dividend date was May 26, 2025.
Dividend Yield
4.32%
Annual Dividend
0.67 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
Annual
Payout Ratio
67.78%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-05-26 | 0.67366 HKD | 2025-07-31 |
| 2024-05-28 | 0.62594 HKD | 2024-07-22 |
* Dividend amounts are adjusted for stock splits when applicable.