LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong
· Delayed Price · Currency is HKD 11.72
+0.04 (0.34%)
Apr 29, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.57 HKD per share, with a yield of 4.91%. The dividend is paid once per year and the next ex-dividend date is May 27, 2026.
Dividend Yield
4.91%
Annual Dividend
0.57 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
89.68%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2025-05-26 | 0.67366 HKD | 2025-07-31 |
| 2024-05-28 | 0.62594 HKD | 2024-07-22 |
* Dividend amounts are adjusted for stock splits when applicable.