Seika Corporation (TYO:8061)
2,967.00
+83.00 (2.88%)
Apr 28, 2026, 3:30 PM JST
Seika Dividend Information
Seika has an annual dividend of 81.67 JPY per share, with a yield of 2.83%. The dividend is paid every six months and the last ex-dividend date was Mar 30, 2026.
Dividend Yield
2.83%
Annual Dividend
81.67 JPY
Ex-Dividend Date
Mar 30, 2026
Payout Frequency
Semi-Annual
Payout Ratio
n/a
Dividend Growth(1Y)
111.36%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| 2026-03-30 | 45.000 JPY | 2026-06-25 |
| 2025-09-29 | 110.000 JPY | 2025-12-05 |
| 2025-03-28 | 43.33333 JPY | 2025-06-25 |
| 2024-09-27 | 30.000 JPY | 2024-12-09 |
| 2024-03-28 | 30.000 JPY | 2024-06-27 |
| 2023-09-28 | 20.000 JPY | 2023-12-11 |
| 2023-03-30 | 18.33333 JPY | 2023-06-28 |
| 2022-09-29 | 11.66667 JPY | 2022-12-02 |
| 2022-03-30 | 13.33333 JPY | 2022-06-29 |
| 2021-09-29 | 8.33333 JPY | 2021-12-03 |
| 2021-03-30 | 8.33333 JPY | 2021-06-25 |
* Dividend amounts are adjusted for stock splits when applicable.